![]() These machines bond insulated wires of 0.0007 to 0.002 inch diameter directly to thin film gold without the need to first strip off the insulation. BOND’S Model 7440E Series are dedicated ultrasonic wire bonders for interconnecting insulated, gold plated, copper wire to thin film sliders or Flex-Circuits of Computer Disk Drives, or for other similar insulated wire connection applications. ![]() All programmed bond variables as well as machine settings for each bond mode are retained in the machines memory. A simple exchange of clamp assemblies, bond tool, and wire path provided with the software mode will allow conventional 45° wire feed, deep access wire or ribbon, ball bonding, insulated wire and single point tab / lead bonding.
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